Session: DA-01-02 Design & Analysis of Heat Exchangers & Components II
Paper Number: 62039
Start Time: Wednesday, July 14, 2021, 05:00 PM
62039 - Correlating Incident Heat Flux and Source Temperature to Meet ASTM E1529 Requirements for RAM Packaging Components Thermal Testing
Often in fire resistance testing of packaging vessels and other components, both the heat source temperature and the incident heat flux on the test specimen might need to be measured and correlated. Standards such as ASTM E1529 require a specified temperature range from the heat source and a specified heat flux on the surface of the test specimen. Other standards might have similar requirements.
The geometry of the test environment and specimen may make heat flux measurements using directional flame thermometers (DFTs) or similar instruments difficult to implement. Orientation is also important to ensure that the heat flux on the surface of the test specimen is properly measured. Other important factors in the flux measurement include the thermal mass and surface emissivity of the test specimen.
This paper describes the development of a calorimeter using water-cooled wide-angle Schmidt-Bolter gages to measure the incident heat flux for a vessel exposed to a radiant heat source. The calorimeter is designed to be modular with varying thermal mass as well as different configurations. The emissivity and thermal mass are designed to match the test specimen as close as possible to properly correlate heat flux with temperature. The results of the incident heat flux and source temperature are discussed.
Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525. SAND2020-12534 A
Presenting Author: Austin Baird Sandia National Laboratories
Authors:
Austin Baird Sandia National LaboratoriesWalt Gill Sandia National Laboratories
Hector Mendoza Sandia National Laboratories
Victor Figueroa Sandia National Laboratories
Correlating Incident Heat Flux and Source Temperature to Meet ASTM E1529 Requirements for RAM Packaging Components Thermal Testing
Category
Technical Paper Publication