[Skip to Content]
Provided by ASME The American Society of Mechanical Engineers
Banner
PVP 2027
Location: Marriott Rive Gauche
Paris, France

Conference: July 25–July 30, 2027
Exhibition: July 26–July 27, 2027
Menu
  • Home
  • Publication Schedule
  • My Account
  • Event Site
  • Policies
    • Conflict in Ukraine
    • Presentation Requirements
    • Confirm Co-Authorship
    • Code of Conduct/Anti-Harassment
    • Artificial Intelligence
    • The Role of the Corresponding Author
  • Help
    • Contact Us
    • Author Resources
      • ASME Presenter Attendance Policy
      • ASME Plagiarism Screening (iThenticate)
      • Full-length Paper Preparation
      • Conference-Specific Information and Templates
      • Copyright Transfer Form
      • Technical Presentation Tips
      • Indexing
      • Author FAQS
      • Submission Types
    • Help Desk Calls
    • Webtool Feedback And Feature Requests
    • Organizer Resources
  • Home
  • ASME 2021 Pressure Vessels & Piping Conference (PVP2021) Session Gallery
  • DA-01-02 Design & Analysis of Heat Exchangers & Components II
  • Correlating Incident Heat Flux and Source Temperature to Meet ASTM E1529 Requirements for RAM Packaging Components Thermal Testing

Session: DA-01-02 Design & Analysis of Heat Exchangers & Components II

Paper Number: 62039

Start Time: Wednesday, July 14, 2021, 05:00 PM

62039 - Correlating Incident Heat Flux and Source Temperature to Meet ASTM E1529 Requirements for RAM Packaging Components Thermal Testing 

Often in fire resistance testing of packaging vessels and other components, both the heat source temperature and the incident heat flux on the test specimen might need to be measured and correlated. Standards such as ASTM E1529 require a specified temperature range from the heat source and a specified heat flux on the surface of the test specimen. Other standards might have similar requirements.

The geometry of the test environment and specimen may make heat flux measurements using directional flame thermometers (DFTs) or similar instruments difficult to implement. Orientation is also important to ensure that the heat flux on the surface of the test specimen is properly measured. Other important factors in the flux measurement include the thermal mass and surface emissivity of the test specimen.  

This paper describes the development of a calorimeter using water-cooled wide-angle Schmidt-Bolter gages to measure the incident heat flux for a vessel exposed to a radiant heat source. The calorimeter is designed to be modular with varying thermal mass as well as different configurations. The emissivity and thermal mass are designed to match the test specimen as close as possible to properly correlate heat flux with temperature. The results of the incident heat flux and source temperature are discussed.

Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525. SAND2020-12534 A

Presenting Author: Austin Baird Sandia National Laboratories

Authors:

Austin Baird Sandia National Laboratories
Walt Gill Sandia National Laboratories
Hector Mendoza Sandia National Laboratories
Victor Figueroa Sandia National Laboratories

Correlating Incident Heat Flux and Source Temperature to Meet ASTM E1529 Requirements for RAM Packaging Components Thermal Testing

Category

Technical Paper Publication

This site supports all modern browsers, such as Chrome, Firefox, Safari, and Edge. Microsoft has announced it will no longer support IE 11 as of August 2021. If you prefer to or you are required to continue using a Microsoft browser, you can use Edge.

  • ASME.ORG
  • Press
  • Terms of Use
  • Privacy Statement
  • ASME Communication Preferences
  • Community Rules

© The American Society of Mechanical Engineers

Stay Connected